Assignee
SAKURAI DAISUKE
JP·12 granted patents·46 citations·filing 2006–2012
Top patents by PatentIndex Score
12 records- 0184US8450848B2Semiconductor device and method for fabricating the sameSAKURAI DAISUKE·Filed 2010·Granted May 28, 2013·8 cites·7 claims
- 0283US8575751B2Conductive bump, method for producing the same, and electronic component mounted structureSAKURAI DAISUKE·Filed 2008·Granted Nov 5, 2013·6 cites·9 claims
- 0380US8120188B2Electronic component mounting structure and method for manufacturing the sameSAKURAI DAISUKE·Filed 2007·Granted Feb 21, 2012·8 cites·10 claims
- 0479US8134081B2Three-dimensional circuit board and its manufacturing methodSAKURAI DAISUKE·Filed 2007·Granted Mar 13, 2012·7 cites·7 claims
- 0577US9238278B2Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer methodSAKURAI DAISUKE·Filed 2012·Granted Jan 19, 2016·4 cites·6 claims
- 0671US8119449B2Method of manufacturing an electronic part mounting structureSAKURAI DAISUKE·Filed 2007·Granted Feb 21, 2012·5 cites·4 claims
- 0770US8083150B2Noncontact information storage medium and method for manufacturing sameSAKURAI DAISUKE·Filed 2006·Granted Dec 27, 2011·8 cites·6 claims
- 0851US8809693B2Three-dimensional circuit boardSAKURAI DAISUKE·Filed 2012·Granted Aug 19, 2014·0 cites·21 claims
- 0942US8742584B2Semiconductor deviceSAKURAI DAISUKE·Filed 2012·Granted Jun 3, 2014·0 cites·17 claims
- 1041US9027822B2Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrateSAKURAI DAISUKE·Filed 2011·Granted May 12, 2015·0 cites·2 claims
- 1138US9373595B2Mounting structure and manufacturing method for sameSAKURAI DAISUKE·Filed 2012·Granted Jun 21, 2016·0 cites·16 claims
- 1238US8921708B2Electronic-component mounted body, electronic component, and circuit boardSAKURAI DAISUKE·Filed 2011·Granted Dec 30, 2014·0 cites·26 claims
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