Assignee
SAMEJIMA SOHEI
JP·5 granted patents·5 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0168US8134085B2Printed interconnection board having a core including carbon fiber reinforced plasticSAMEJIMA SOHEI·Filed 2008·Granted Mar 13, 2012·4 cites·8 claims
- 0260US9313903B2Method of manufacturing printed wiring boardSAMEJIMA SOHEI·Filed 2009·Granted Apr 12, 2016·1 cites·3 claims
- 0347US9144942B2Method for producing fiber-reinforced plastic molding, preform and method for producing same, and adhesive filmSAMEJIMA SOHEI·Filed 2011·Granted Sep 29, 2015·0 cites·2 claims
- 0444US8935851B2Method for manufacturing a circuit boardSAMEJIMA SOHEI·Filed 2011·Granted Jan 20, 2015·0 cites·5 claims
- 0543US10099460B2Method for producing preform and method for producing fiber-reinforced plastic moldingSAMEJIMA SOHEI·Filed 2012·Granted Oct 16, 2018·0 cites·3 claims
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