Assignee

SAMPO SEMICONDUCTOR CORP

TW·4 granted patents·193 citations·filing 1998–1998

Technology mixH10W4

Top patents by PatentIndex Score

4 records

0191US6201302B1Semiconductor package having multi-diesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Mar 13, 2001·155 cites·18 claims
0258US5973407AIntegral heat spreader for semiconductor packageSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Oct 26, 1999·28 cites·2 claims
0333US6101101AUniversal leadframe for semiconductor devicesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Aug 8, 2000·7 cites·1 claims
0431US5998857ASemiconductor packaging structure with the bar on chipSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Dec 7, 1999·3 cites·3 claims

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