Assignee
SAN EI KAGAKU CO
JP·14 granted patents·2 pending applications·115 citations·filing 1982–2019
Top patents by PatentIndex Score
16 records- 0195US6878368B2Composition for blending to hair treating agents and a hair treating agentSAN EI KAGAKU CO·Filed 2002·Granted Apr 12, 2005·69 cites·28 claims
- 0287US7150868B2Composition for blending to hair treating agent and hair treating agentSAN EI KAGAKU CO·Filed 2005·Granted Dec 19, 2006·4 cites·7 claims
- 0383US6939537B2Composition for blending to hair treating agents and a hair treating agentSAN EI KAGAKU CO·Filed 2002·Granted Sep 6, 2005·13 cites·30 claims
- 0477US7718817B2Vegetable sterol ester-containing composition and additive that increases the feeling effects from a hair cosmeticSAN EI KAGAKU CO·Filed 2006·Granted May 18, 2010·2 cites·7 claims
- 0575US9072205B1Surface mounting method utilizing active resin compositionSAN EI KAGAKU CO·Filed 2015·Granted Jun 30, 2015·1 cites·12 claims
- 0668US7052682B2Composition for blending to hair treating agents and a hair treating agentSAN EI KAGAKU CO·Filed 2004·Granted May 30, 2006·2 cites·13 claims
- 0757US6812299B2Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resinSAN EI KAGAKU CO·Filed 2002·Granted Nov 2, 2004·7 cites·14 claims
- 0856US6835375B2Composition for blending to hair treating agent and a hair treating agentSAN EI KAGAKU CO·Filed 2002·Granted Dec 28, 2004·0 cites·4 claims
- 0954US7396885B2Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring boardSAN EI KAGAKU CO·Filed 2002·Granted Jul 8, 2008·5 cites·1 claims
- 1048US7410673B2Smooth board and process for preparing a smooth boardSAN EI KAGAKU CO·Filed 2004·Granted Aug 12, 2008·3 cites·16 claims
- 1147US12412859B2Via wiring formation substrate, manufacturing method for via wiring formation substrate, and semiconductor device mounting componentSAN EI KAGAKU CO·Filed 2019·Granted Sep 9, 2025·0 cites·21 claims
- 1244US2011031300A1Cleaning-free activated resinous composition and method for surface mounting using the sameSAN EI KAGAKU CO·Filed 2010·Application pending·0 cites
- 1339US10870725B2Heat curable resin composition, and circuit board with electronic component mounted thereonSAN EI KAGAKU CO·Filed 2017·Granted Dec 22, 2020·0 cites·5 claims
- 1433US2009087775A1Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the sameSAN EI KAGAKU CO·Filed 2008·Application pending·0 cites
- 1528US4474193AMethod and apparatus for diagnosis of hair for permanent wavingSAN EI KAGAKU CO·Filed 1982·Granted Oct 2, 1984·4 cites·3 claims
- 1627US4675181ADeodorant for permanent waving agentSAN EI KAGAKU CO·Filed 1985·Granted Jun 23, 1987·5 cites·12 claims
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