Assignee
SANDISK INFORMATION TECH SHANGHAI CO LTD
CN·10 granted patents·1 pending application·29 citations·filing 2016–2018
Top patents by PatentIndex Score
11 records- 0192US10242965B2Semiconductor device including interconnected package on packageSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 26, 2019·9 cites·10 claims
- 0288US10177119B2Fan out semiconductor device including a plurality of semiconductor dieSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jan 8, 2019·6 cites·20 claims
- 0381US10490529B2Angled die semiconductor deviceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Nov 26, 2019·3 cites·22 claims
- 0477US10236276B2Semiconductor device including vertically integrated groups of semiconductor packagesSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 19, 2019·4 cites·17 claims
- 0570US9947606B2Semiconductor device including electromagnetic absorption and shieldingSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2016·Granted Apr 17, 2018·2 cites·15 claims
- 0668US10811386B2Semiconductor deviceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Oct 20, 2020·2 cites·13 claims
- 0765US11031371B2Semiconductor package and method of fabricating semiconductor packageSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jun 8, 2021·2 cites·17 claims
- 0863US11177239B2Semiconductor device including control switches to reduce pin capacitanceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2018·Granted Nov 16, 2021·1 cites·19 claims
- 0944US10818575B2Datacenter 3D solid state drives with matrix coolingSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·26 claims
- 1042US10734354B2Semiconductor device including optically connected wafer stackSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·21 claims
- 1139US2019189591A1Semiconductor storage cube with enhanced sidewall planaritySANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2018·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →