Assignee
SATO ISSAKU
JP·3 granted patents·1 pending application·7 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0181US8403199B2Localized jet soldering device and partial jet soldering methodSATO ISSAKU·Filed 2010·Granted Mar 26, 2013·6 cites·13 claims
- 0256US8302835B2Point flow soldering apparatusSATO ISSAKU·Filed 2009·Granted Nov 6, 2012·1 cites·5 claims
- 0351US8544713B2Apparatus and method of coating fluxSATO ISSAKU·Filed 2009·Granted Oct 1, 2013·0 cites·2 claims
- 0449US2012224837A1Solder bath and method of heating solder contained in the solder bathSATO ISSAKU·Filed 2012·Application pending·0 cites
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