Assignee
SCHLOTTER GMBH & CO KG MAX DR
DE·5 granted patents·78 citations·filing 1985–2001
Top patents by PatentIndex Score
5 records- 0180US6998036B2Electrolyte and method for depositing tin-silver alloy layersSCHLOTTER GMBH & CO KG MAX DR·Filed 2001·Granted Feb 14, 2006·19 cites·9 claims
- 0270US7179362B2Electrolyte and method for depositing tin-copper alloy layersSCHLOTTER GMBH & CO KG MAX DR·Filed 2001·Granted Feb 20, 2007·19 cites·11 claims
- 0365US4666739AProcess for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuitsSCHLOTTER GMBH & CO KG MAX DR·Filed 1985·Granted May 19, 1987·30 cites·18 claims
- 0456US6770185B2Aqueous solution for electrodepositing tin-zinc alloysSCHLOTTER GMBH & CO KG MAX DR·Filed 2001·Granted Aug 3, 2004·2 cites·14 claims
- 0536US4650548AProcess for preserving the solderability of through hole plated printed circuit boardsSCHLOTTER GMBH & CO KG MAX DR·Filed 1985·Granted Mar 17, 1987·8 cites·4 claims
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