Assignee
SEKI YUKI
JP·2 granted patents·4 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0165US8497185B2Method of manufacturing semiconductor wafer, and composite base and composite substrate for use in that methodSEKI YUKI·Filed 2011·Granted Jul 30, 2013·2 cites·12 claims
- 0264US9184228B2Composite base including sintered base and base surface flattening layer, and composite substrate including that composite base and semiconductor crystalline layerSEKI YUKI·Filed 2011·Granted Nov 10, 2015·2 cites·7 claims
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