Assignee
SEKISUI FULLER CO LTD
JP·4 granted patents·5 pending applications·0 citations·filing 2013–2022
Top patents by PatentIndex Score
9 records- 0159US9676975B2Adhesive compositionSEKISUI FULLER CO LTD·Filed 2014·Granted Jun 13, 2017·0 cites·7 claims
- 0257US11981792B2Curable composition and coating film waterproofing agentSEKISUI FULLER CO LTD·Filed 2019·Granted May 14, 2024·0 cites·2 claims
- 0354US9695346B2Adhesive for floor structureSEKISUI FULLER CO LTD·Filed 2013·Granted Jul 4, 2017·0 cites·4 claims
- 0454US2021222027A1Hot melt coating agent for component-mounted electronic circuit boardSEKISUI FULLER CO LTD·Filed 2019·Application pending·0 cites
- 0552US2021230382A1Thermoplastic Resin Film, Meltable Bag, and Packaged Hot-Melt AdhesiveSEKISUI FULLER CO LTD·Filed 2019·Application pending·0 cites
- 0650US2025361378A1Curable composition for sealing material, and panel structure using said curable compositionSEKISUI FULLER CO LTD·Filed 2022·Application pending·0 cites
- 0740US12281240B2Synthetic resin composition, fire-proof material, sealing material, adhesive, and joint structureSEKISUI FULLER CO LTD·Filed 2019·Granted Apr 22, 2025·0 cites·13 claims
- 0840US2018100091A1Hot melt adhesives and disposable products using the sameSEKISUI FULLER CO LTD·Filed 2016·Application pending·0 cites
- 0938US2016083634A1Curable composition and joint structure produced using sameSEKISUI FULLER CO LTD·Filed 2014·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when SEKISUI FULLER CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →