Assignee
SEKIYA KAZUMA
JP·7 granted patents·4 pending applications·16 citations·filing 2007–2012
Top patents by PatentIndex Score
11 records- 0190US8431428B2Optical device wafer processing method and laser processing apparatusSEKIYA KAZUMA·Filed 2011·Granted Apr 30, 2013·11 cites·2 claims
- 0275US8541287B2Laser processing method for waferSEKIYA KAZUMA·Filed 2012·Granted Sep 24, 2013·3 cites·4 claims
- 0368US8104665B2Manufacturing method for composite substrateSEKIYA KAZUMA·Filed 2010·Granted Jan 31, 2012·2 cites·1 claims
- 0453US8417579B2Method of managing partsSEKIYA KAZUMA·Filed 2011·Granted Apr 9, 2013·0 cites·2 claims
- 0551US2009036034A1Semiconductor wafer and processing method for sameSEKIYA KAZUMA·Filed 2008·Application pending·0 cites
- 0649US2012286573A1Power managing systemSEKIYA KAZUMA·Filed 2012·Application pending·0 cites
- 0745US2007238264A1Method and apparatus for supporting waferSEKIYA KAZUMA·Filed 2007·Application pending·0 cites
- 0844US10056246B2Semiconductor waferSEKIYA KAZUMA·Filed 2007·Granted Aug 21, 2018·0 cites·3 claims
- 0942US2012286971A1Signal systemSEKIYA KAZUMA·Filed 2012·Application pending·0 cites
- 1041US8198175B2Processing method for package substrateSEKIYA KAZUMA·Filed 2011·Granted Jun 12, 2012·0 cites·3 claims
- 1140US9048349B2Optical device wafer processing methodSEKIYA KAZUMA·Filed 2011·Granted Jun 2, 2015·0 cites·6 claims
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