Assignee
SEMICONDUCTOR MFG INT BEIJING CORP
CN·152 granted patents·25 pending applications·170 citations·filing 2014–2024
Top patents by PatentIndex Score
177 records- 0195US9406555B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2015·Granted Aug 2, 2016·14 cites·17 claims
- 0294US9576897B2Semiconductor interconnect deviceSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Feb 21, 2017·10 cites·10 claims
- 0391US11728378B2Semiconductor device and method for manufacturing sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2021·Granted Aug 15, 2023·2 cites·6 claims
- 0491US10312329B2Semiconductor device and manufacturing method thereforSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Jun 4, 2019·6 cites·15 claims
- 0590US9923065B2Fabricating method of fin-type semiconductor deviceSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Mar 20, 2018·6 cites·12 claims
- 0688US11631767B2Semiconductor structure and method of forming a semiconductor structureSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2021·Granted Apr 18, 2023·1 cites·7 claims
- 0788US10037943B2Metal gate transistor and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Jul 31, 2018·4 cites·20 claims
- 0888US9950405B2Chemical mechanical planarization apparatus and methodsSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2014·Granted Apr 24, 2018·20 cites·19 claims
- 0988US9419057B2Resistive random access memory device and manufacturing methodsSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2015·Granted Aug 16, 2016·5 cites·20 claims
- 1087US9984939B2Well implantation process for FinFET deviceSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted May 29, 2018·4 cites·13 claims
- 1187US9577063B2Bipolar transistor, band-gap reference circuit and virtual ground reference circuit and methods of fabricating thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Feb 21, 2017·5 cites·16 claims
- 1286US9646865B1Interconnection structure, fabricating method thereof, and exposure alignment systemSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted May 9, 2017·6 cites·20 claims
- 1385US10211309B2Method and device for metal gate stacksSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Feb 19, 2019·4 cites·14 claims
- 1485US9472422B2Semiconductor device structure and manufacturing methodsSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2015·Granted Oct 18, 2016·4 cites·20 claims
- 1584US10937692B2Method for reducing via RC delaySEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Mar 2, 2021·4 cites·16 claims
- 1683US10685838B1Semiconductor structure providing for an increased pattern density on a substrate and method for forming sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Jun 16, 2020·10 cites·18 claims
- 1783US9919918B2Wafer-level bonding packaging method and wafer structureSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Mar 20, 2018·4 cites·20 claims
- 1882US10574221B2Comparator, integrated circuit, and methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Feb 25, 2020·3 cites·14 claims
- 1982US10078108B2Test structure, fabrication method, and test methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Sep 18, 2018·3 cites·20 claims
- 2082US9978760B2Semiconductor device and related manufacturing methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted May 22, 2018·4 cites·20 claims
- 2181US10304926B2Top-down method for fabricating nanowire deviceSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted May 28, 2019·3 cites·16 claims
- 2279US10998396B2Semiconductor structure and method for forming a semiconductor structureSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted May 4, 2021·5 cites·18 claims
- 2378US10155296B2Polishing padSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Dec 18, 2018·1 cites·18 claims
- 2477US10134698B2Bonding pad structure, bonding ring structure, and MEMS device packaging methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Nov 20, 2018·4 cites·11 claims
- 2577US10083879B2Semiconductor nanowire device and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Sep 25, 2018·2 cites·20 claims
- 2676US9541463B2Capacitive pressure sensorsSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2015·Granted Jan 10, 2017·2 cites·18 claims
- 2775US11276698B2Flash memory device and manufacture thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Mar 15, 2022·2 cites·12 claims
- 2875US10804157B2Semiconductor apparatus and manufacturing methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Oct 13, 2020·2 cites·8 claims
- 2975US10249508B2Method for preventing excessive etching of edges of an insulator layerSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Apr 2, 2019·1 cites·17 claims
- 3075US10177027B2Method for reducing cracks in a step-shaped cavitySEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Jan 8, 2019·2 cites·18 claims
- 3173US10833062B2Diode design of FinFET deviceSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Nov 10, 2020·1 cites·19 claims
- 3273US10056302B2Semiconductor device and related manufacturing methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Aug 21, 2018·2 cites·16 claims
- 3372US10340274B2LDMOS FinFET deviceSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Jul 2, 2019·1 cites·20 claims
- 3472US10090246B2Metal interconnect structure and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Oct 2, 2018·2 cites·16 claims
- 3571US11069565B2Semiconductor interconnect structure and manufacturing method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Jul 20, 2021·1 cites·8 claims
- 3671US10418283B2Method and device to improve shallow trench isolationSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Sep 17, 2019·1 cites·12 claims
- 3771US10134849B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Nov 20, 2018·1 cites·12 claims
- 3870US11063119B2Semiconductor structure and method for forming the sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Jul 13, 2021·1 cites·14 claims
- 3970US10964823B2Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Mar 30, 2021·1 cites·17 claims
- 4070US9557348B2Semiconductor testing structures and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2014·Granted Jan 31, 2017·2 cites·16 claims
- 4169US11508848B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2020·Granted Nov 22, 2022·0 cites·6 claims
- 4269US11407082B2Method and system for monitoring polishing padSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2018·Granted Aug 9, 2022·0 cites·20 claims
- 4369US10991794B2Semiconductor device and method for manufacturing sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2018·Granted Apr 27, 2021·1 cites·11 claims
- 4469US10446648B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Oct 15, 2019·1 cites·8 claims
- 4569US10448168B2MEMS microphone having reduced leakage current and method of manufacturing the sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Oct 15, 2019·1 cites·20 claims
- 4669US9548359B2Methods for forming vertical semiconductor pillarsSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2015·Granted Jan 17, 2017·1 cites·11 claims
- 4769US9419090B2Interconnect structures and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2014·Granted Aug 16, 2016·2 cites·13 claims
- 4868US11785755B2Static random-access memory and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2021·Granted Oct 10, 2023·0 cites·11 claims
- 4966US10572380B2Structures of bottom select transistor for embedding 3D-NAND in BEOL and methodsSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Feb 25, 2020·2 cites·20 claims
- 5066US10204809B2Method for thermal treatment using heat reservoir chamberSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2017·Granted Feb 12, 2019·1 cites·18 claims
Showing the top 50 of 177 patent records by PatentIndex Score.
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