Assignee
SEMILEDS CORP
TW·15 granted patents·4 pending applications·473 citations·filing 2005–2024
Top patents by PatentIndex Score
19 records- 0198US7186580B2Light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2005·Granted Mar 6, 2007·86 cites·18 claims
- 0297US7432119B2Light emitting diode with conducting metal substrateSEMILEDS CORP·Filed 2005·Granted Oct 7, 2008·56 cites·6 claims
- 0397US7195944B2Systems and methods for producing white-light emitting diodesSEMILEDS CORP·Filed 2005·Granted Mar 27, 2007·80 cites·10 claims
- 0496US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0596US7646033B2Systems and methods for producing white-light light emitting diodesSEMILEDS CORP·Filed 2007·Granted Jan 12, 2010·53 cites·20 claims
- 0696US7524686B2Method of making light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2007·Granted Apr 28, 2009·48 cites·19 claims
- 0796US7473936B2Light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2006·Granted Jan 6, 2009·39 cites·6 claims
- 0896US7413918B2Method of making a light emitting diodeSEMILEDS CORP·Filed 2005·Granted Aug 19, 2008·38 cites·37 claims
- 0995US7629195B2Method of making light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2008·Granted Dec 8, 2009·31 cites·7 claims
- 1094US7378288B2Systems and methods for producing light emitting diode arraySEMILEDS CORP·Filed 2005·Granted May 27, 2008·32 cites·20 claims
- 1186US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 1285US11545474B2Method and system for transferring alignment marks between substrate systemsSEMILEDS CORP·Filed 2021·Granted Jan 3, 2023·1 cites·13 claims
- 1381US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 1480US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 1579US8008678B2Light-emitting diode with increased light extractionSEMILEDS CORP·Filed 2008·Granted Aug 30, 2011·5 cites·21 claims
- 1672US12002792B2Method and system for transferring alignment marks between substrate systemsSEMILEDS CORP·Filed 2022·Granted Jun 4, 2024·0 cites·18 claims
- 1764US2025157859A1Methods for fabricating semiconductor devices by forming and removing epitaxial (epi) structures from an engineered substrateSEMILEDS CORP·Filed 2024·Application pending·0 cites
- 1855US2022320366A1Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 1953US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
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