Assignee
SES CO LTD
JP·4 granted patents·3 pending applications·149 citations·filing 1997–2007
Top patents by PatentIndex Score
7 records- 0182US5951779ATreatment method of semiconductor wafers and the like and treatment system for the sameSES CO LTD·Filed 1997·Granted Sep 14, 1999·95 cites·8 claims
- 0277US7437834B2Method of processing substrate and substrate processing apparatusSES CO LTD·Filed 2003·Granted Oct 21, 2008·30 cites·7 claims
- 0356US7648580B2Substrate processing method and substrate processing deviceSES CO LTD·Filed 2003·Granted Jan 19, 2010·8 cites·4 claims
- 0445US6695926B1Treatment method of semiconductor wafers and the like and treatment system for the sameSES CO LTD·Filed 1999·Granted Feb 24, 2004·16 cites·6 claims
- 0545US2010092661A1Electroless plating methodSES CO LTD·Filed 2007·Application pending·0 cites
- 0638US2008105286A1Substrate Treatment ApparatusSES CO LTD·Filed 2005·Application pending·0 cites
- 0737US2008035182A1Substrate Treatment ApparatusSES CO LTD·Filed 2005·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →