Assignee
SH MATERIALS CO LTD
JP·6 granted patents·7 citations·filing 2014–2017
Top patents by PatentIndex Score
6 records- 0169US9735096B1Lead frame and method for manufacturing the sameSH MATERIALS CO LTD·Filed 2015·Granted Aug 15, 2017·3 cites·6 claims
- 0266US9691689B2Lead frame for mounting semiconductor element and method for manufacturing the sameSH MATERIALS CO LTD·Filed 2014·Granted Jun 27, 2017·3 cites·10 claims
- 0358US9735106B2Semiconductor lead frame, semiconductor package, and manufacturing method thereofSH MATERIALS CO LTD·Filed 2016·Granted Aug 15, 2017·1 cites·16 claims
- 0438US9870930B2Method for producing substrate for mounting semiconductor elementSH MATERIALS CO LTD·Filed 2014·Granted Jan 16, 2018·0 cites·12 claims
- 0534US9583422B2Lead frameSH MATERIALS CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·5 claims
- 0629US10181436B2Lead frame and method of manufacturing the sameSH MATERIALS CO LTD·Filed 2017·Granted Jan 15, 2019·0 cites·6 claims
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