Assignee
SHANGHAI INTEGRATED CIRCUIT RES AND DEV CENTER CO LTD
CN·1 granted patent·1 pending application·1 citations·filing 2014–2014
Top patents by PatentIndex Score
2 records- 0155US9640434B2Method for processing an electroplated copper film in copper interconnect processSHANGHAI INTEGRATED CIRCUIT RES AND DEV CENTER CO LTD·Filed 2014·Granted May 2, 2017·1 cites·11 claims
- 0231US2017213897A1Method of fabricating pmos devices with embedded sigeSHANGHAI INTEGRATED CIRCUIT RES AND DEV CENTER CO LTD·Filed 2014·Application pending·0 cites
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