Assignee
SHANGHAI KAIHONG TECHNOLOGY CO
CN·6 granted patents·66 citations·filing 2006–2008
Top patents by PatentIndex Score
6 records- 0185US7682874B2Chip scale package (CSP) assembly apparatus and methodSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2006·Granted Mar 23, 2010·15 cites·18 claims
- 0282US7745261B2Chip scale package fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2008·Granted Jun 29, 2010·11 cites·15 claims
- 0380US7402459B2Quad flat no-lead (QFN) chip package assembly apparatus and methodSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2006·Granted Jul 22, 2008·13 cites·14 claims
- 0479US7834433B2Semiconductor power deviceSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2007·Granted Nov 16, 2010·12 cites·24 claims
- 0577US7517726B1Wire bonded chip scale package fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2008·Granted Apr 14, 2009·9 cites·20 claims
- 0674US7713784B2Thin quad flat package with no leads (QFN) fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2008·Granted May 11, 2010·6 cites·12 claims
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