Assignee
SHENZHEN BOKE NEW MAT CO LTD
CN·0 granted patents·2 pending applications·0 citations·filing 2020–2020
Technology mixH01F2
Top patents by PatentIndex Score
2 records- 0143US2022301768A1Method for Manufacturing A Molded Composite Inductor and Molded Composite InductorSHENZHEN BOKE NEW MAT CO LTD·Filed 2020·Application pending·0 cites
- 0242US2022293315A1Internally Embedded Copper Plate-Type Soft Magnetic Powder Core Inductor, Preparation Method Therefor, and Use ThereofSHENZHEN BOKE NEW MAT CO LTD·Filed 2020·Application pending·0 cites
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