Assignee

SHENZHEN HONGHAI TECH CO LTD

CN·1 granted patent·0 citations·filing 2024–2024

Technology mixC04B1 C23C1 C25D1 H01L1 H01S1 H10W1

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1 record

0154US12381126B1Silicon carbide copper-plated gold-tin-preset heat sink structure and fabrication method thereofSHENZHEN HONGHAI TECH CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·11 claims

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