Assignee
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD
CN·8 granted patents·2 pending applications·5 citations·filing 2016–2025
Top patents by PatentIndex Score
10 records- 0181US10615151B2Integrated circuit multichip stacked packaging structure and methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Apr 7, 2020·4 cites·20 claims
- 0267US10847496B2Chip wiring method and structureSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2017·Granted Nov 24, 2020·1 cites·19 claims
- 0359US2026068763A1Three-dimensional stacking fan-out packaging device and preparation method for three-dimensional stacking fan-out packaging deviceSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 0447US12266623B2Substrate bonding methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 0547US10867959B2Integrated circuit packaging method and integrated packaged circuitSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Dec 15, 2020·0 cites·15 claims
- 0643US12575432B2Chip fine line fan-out package structure and manufacturing method thereforSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2020·Granted Mar 10, 2026·0 cites·20 claims
- 0741US2025174565A1Embedded three-dimensional fan-out package structure and preparation method thereofSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 0838US11183458B2Integrated circuit packaging structure and methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Nov 23, 2021·0 cites·7 claims
- 0936US10930634B2Integrated circuit system and packaging method thereforSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Feb 23, 2021·0 cites·19 claims
- 1035US11335664B2Integrated circuit packaging method and integrated packaging circuitSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted May 17, 2022·0 cites·13 claims
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