Assignee
SHI HONGBIN
KR·3 granted patents·8 citations·filing 2016–2017
Top patents by PatentIndex Score
3 records- 0184US9985008B2Method of fabricating a semiconductor packageSHI HONGBIN·Filed 2017·Granted May 29, 2018·6 cites·16 claims
- 0257US9953964B2Method for manufacturing semiconductor packageSHI HONGBIN·Filed 2016·Granted Apr 24, 2018·1 cites·15 claims
- 0354US9786644B2Methods of fabricating a semiconductor packageSHI HONGBIN·Filed 2016·Granted Oct 10, 2017·1 cites·20 claims
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