Assignee
SHIN ETSU HANDOTAI CO LTD
JP·23 granted patents·25 pending applications·3 citations·filing 2001–2025
Top patents by PatentIndex Score
48 records- 0165US2025327211A1Epitaxial waferSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 0265US2026090332A1Susceptor for epitaxial growth and method for producing epitaxial waferSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 0364US12581771B2Method for manufacturing epitaxial wafer for ultraviolet ray emission device, method for manufacturing substrate for ultra violet ray emission device, epitaxial wafer for ultraviolet ray emission device, and substrate for ultraviolet ray emission deviceSHIN ETSU HANDOTAI CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·17 claims
- 0462US2026078527A1Single crystal silicon substrate with nitride semiconductor layer and method for producing single crystal silicon substrate with nitride semiconductor layerSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 0558US2025364269A1Method for producing semiconductor wafer and semiconductor waferSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 0657US12454767B2Single crystal manufacturing apparatusSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Oct 28, 2025·0 cites·11 claims
- 0757US12387126B2Method for producing semiconductor apparatus for quantum computerSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Aug 12, 2025·0 cites·12 claims
- 0856US12345659B2Method for measuring DIC defect shape on silicon wafer and polishing methodSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Jul 1, 2025·0 cites·4 claims
- 0956US2026063417A1Debris determination methodSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1056US2025369103A1Method for growing diamond layer and microwave plasma cvd apparatusSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1156US2026006943A1Method for producing light emitting deviceSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1255US2026011551A1Group-iii nitride semiconductor wafer and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1355US2026047406A1Method for manufacturing silicon substrate for quantum computer, silicon substrate for quantum computer, and semiconductor apparatusSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1455US2025391731A1Member having heat spreader structure and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1555US2025313989A1Method for producing heteroepitaxial waferSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1654US12576473B2Single-side polishing apparatus, single-side polishing method, and polishing padSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Mar 17, 2026·0 cites·9 claims
- 1754US12368107B2Method for producing semiconductor apparatus and semiconductor apparatusSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·8 claims
- 1854US2025063786A1Nitride semiconductor substrate and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 1954US2025273587A1Substrate for electronic device and method for producing the sameSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 2054US2025113662A1Wafer having micro-led structure, method for manufacturing wafer having micro-led structure, and method for manufacturing bonded semiconductor wafer having micro-led structureSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 2154US2025154646A1Substrate for high-frequency device, and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 2253US12571124B2Method for measuring distance between lower end surface of heat shielding member and surface of raw material melt, method for controlling distance between lower end surface of heat shielding member and surface of raw material melt and method for manufacturing silicon single crystalSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Mar 10, 2026·0 cites·11 claims
- 2353US12438101B2Bonded semiconductor light-receiving device and method for manufacturing bonded semiconductor light-receiving deviceSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·16 claims
- 2453US6729941B2Process for manufacturing semiconductor wafer and semiconductor waferSHIN ETSU HANDOTAI & CO LTD·Filed 2001·Granted May 4, 2004·3 cites·16 claims
- 2553US2025109488A1Method for growing diamond on silicon substrate and method for selectively growing diamond on silicon substrateSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 2653US2025031421A1Substrate for electronic device and method for producing the sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 2752US12449378B2Edge portion measuring apparatus and method for measuring edge portionSHIN ETSU HANDOTAI CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·16 claims
- 2852US12440943B2Method and apparatus for polishing waferSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·10 claims
- 2952US2025316541A1Method for producing bonded light-emitting device wafer and method for transferring micro ledSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 3052US2025163609A1Method for producing heteroepitaxial filmSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 3151US12597124B2Debris determination methodSHIN ETSU HANDOTAI CO LTD·Filed 2022·Granted Apr 7, 2026·0 cites·17 claims
- 3251US2025323037A1Nitride semiconductor substrate and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 3350US12227872B2Single-crystal pulling apparatus and single-crystal pulling methodSHIN ETSU HANDOTAI CO LTD·Filed 2020·Granted Feb 18, 2025·0 cites·10 claims
- 3450US2025059675A1Nitride semiconductor substrate and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 3549US12482647B2Method for forming thermal oxide film on semiconductor substrateSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·18 claims
- 3649US2025169226A1Method for manufacturing bonded semiconductor waferSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 3749US2025059676A1Nitride semiconductor substrate and method for producing nitride semiconductor substrateSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 3848US12575220B2Electronic device and method for producing the sameSHIN ETSU HANDOTAI CO LTD·Filed 2020·Granted Mar 10, 2026·0 cites·1 claims
- 3948US12345660B2Method for evaluating crystal defects in silicon carbide single crystal waferSHIN ETSU HANDOTAI CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 4048US12308225B2Method for forming thermal oxide film on semiconductor substrateSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted May 20, 2025·0 cites·18 claims
- 4148US12300553B2Method for evaluating semiconductor wafer, method for selecting semiconductor wafer and method for fabricating deviceSHIN ETSU HANDOTAI CO LTD·Filed 2020·Granted May 13, 2025·0 cites·19 claims
- 4248US12266520B2Method for manufacturing epitaxial wafer, silicon-based substrate for epitaxial growth, and epitaxial waferSHIN ETSU HANDOTAI CO LTD·Filed 2019·Granted Apr 1, 2025·0 cites·11 claims
- 4344US2025333878A1Method for producing silicon single crystalSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 4442US12500077B2Epitaxial wafer cleaning methodSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·6 claims
- 4542US12377509B2Manufacturing method for a substrate waferSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·15 claims
- 4641US12474275B2Inspection apparatus and inspection methodSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·15 claims
- 4741US12272542B2Apparatus for cleaning semiconductor silicon wafer and method for cleaning semiconductor silicon waferSHIN ETSU HANDOTAI CO LTD·Filed 2019·Granted Apr 8, 2025·0 cites·14 claims
- 4840US2025246440A1Method for measuring resistivity of silicon single crystalSHIN ETSU HANDOTAI CO LTD·Filed 2025·Application pending·0 cites
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