Assignee
SHIN ETSU HANDOTAL CO LTD
JP·3 granted patents·50 citations·filing 1978–2000
Top patents by PatentIndex Score
3 records- 0184US6492682B1Method of producing a bonded wafer and the bonded waferSHIN ETSU HANDOTAL CO LTD·Filed 2000·Granted Dec 10, 2002·35 cites·1 claims
- 0237US5429544APolishing apparatus for notch portion of waferSHIN ETSU HANDOTAL CO LTD·Filed 1994·Granted Jul 4, 1995·10 cites·17 claims
- 0328US4213086ASelector device for the determination of the type of electroconductivity in semiconductor wafersSHIN ETSU HANDOTAL CO LTD·Filed 1978·Granted Jul 15, 1980·5 cites·1 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →