Assignee
SHINKAI HIROYUKI
JP·3 granted patents·12 citations·filing 2007–2020
Top patents by PatentIndex Score
3 records- 0181US11587877B2Semiconductor device in which peeling off of sealing resin from the wire is suppressedSHINKAI HIROYUKI·Filed 2020·Granted Feb 21, 2023·1 cites·18 claims
- 0280US8643180B2Semiconductor deviceSHINKAI HIROYUKI·Filed 2007·Granted Feb 4, 2014·10 cites·54 claims
- 0356US9343416B2Semiconductor device employing wafer level chip size package technologySHINKAI HIROYUKI·Filed 2007·Granted May 17, 2016·1 cites·19 claims
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