Assignee
SHINKAWA KK
JP·462 granted patents·75 pending applications·4,905 citations·filing 1983–2023
Top patents by PatentIndex Score
537 records- 0197US7857190B2Wire bonding apparatus, record medium storing bonding control program, and bonding methodSHINKAWA KK·Filed 2010·Granted Dec 28, 2010·67 cites·3 claims
- 0297US7621436B2Wire bonding methodSHINKAWA KK·Filed 2006·Granted Nov 24, 2009·128 cites·11 claims
- 0396US7743964B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2008·Granted Jun 29, 2010·23 cites·64 claims
- 0495US7975901B2Bonding apparatus and wire bonding methodSHINKAWA KK·Filed 2010·Granted Jul 12, 2011·28 cites·13 claims
- 0595US6687988B1Method for forming pin-form wires and the likeSHINKAWA KK·Filed 2000·Granted Feb 10, 2004·115 cites·4 claims
- 0695US6581283B2Method for forming pin-form wires and the likeSHINKAWA KK·Filed 2000·Granted Jun 24, 2003·113 cites·4 claims
- 0792US9457421B2Wire-bonding apparatus and method of wire bondingSHINKAWA KK·Filed 2015·Granted Oct 4, 2016·7 cites·9 claims
- 0892US7821140B2Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2010·Granted Oct 26, 2010·16 cites·6 claims
- 0992US7726546B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2008·Granted Jun 1, 2010·13 cites·28 claims
- 1091US11024596B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2017·Granted Jun 1, 2021·7 cites·20 claims
- 1189US12046574B2Ultrasonic horn and manufacturing apparatus of semiconductor deviceSHINKAWA KK·Filed 2021·Granted Jul 23, 2024·2 cites·5 claims
- 1289US11691214B2Ultrasound hornSHINKAWA KK·Filed 2021·Granted Jul 4, 2023·4 cites·26 claims
- 1389US11373975B2Electronic component mounting deviceSHINKAWA KK·Filed 2017·Granted Jun 28, 2022·7 cites·4 claims
- 1487US9793236B2Wire-bonding apparatus and method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2015·Granted Oct 17, 2017·7 cites·4 claims
- 1587US9337166B2Wire bonding apparatus and bonding methodSHINKAWA KK·Filed 2013·Granted May 10, 2016·9 cites·10 claims
- 1687US7699209B2Wire bonding apparatus, record medium storing bonding control program, and bonding methodSHINKAWA KK·Filed 2006·Granted Apr 20, 2010·17 cites·9 claims
- 1787US6505397B1Die holding mechanism for a die with connecting wires thereonSHINKAWA KK·Filed 2000·Granted Jan 14, 2003·32 cites·3 claims
- 1886US12087725B2Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatusSHINKAWA KK·Filed 2020·Granted Sep 10, 2024·2 cites·8 claims
- 1986US6722840B2Wafer ring supplying and returning apparatusSHINKAWA KK·Filed 2002·Granted Apr 20, 2004·38 cites·1 claims
- 2086US4526646AInner lead bonderSHINKAWA KK·Filed 1983·Granted Jul 2, 1985·67 cites·11 claims
- 2185US10118246B2Mounting apparatusSHINKAWA KK·Filed 2017·Granted Nov 6, 2018·9 cites·12 claims
- 2285US7686204B2Wire bonding apparatus, record medium storing bonding control program, and bonding methodSHINKAWA KK·Filed 2006·Granted Mar 30, 2010·13 cites·6 claims
- 2385US5953624ABump forming methodSHINKAWA KK·Filed 1998·Granted Sep 14, 1999·116 cites·2 claims
- 2484US11094567B2Mounting apparatus and method for manufacturing semiconductor deviceSHINKAWA KK·Filed 2018·Granted Aug 17, 2021·4 cites·18 claims
- 2584US10068872B2Mounting apparatus and method of correcting offset amount of the sameSHINKAWA KK·Filed 2016·Granted Sep 4, 2018·4 cites·2 claims
- 2684US9406640B2Flip chip bonder and method of correcting flatness and deformation amount of bonding stageSHINKAWA KK·Filed 2015·Granted Aug 2, 2016·5 cites·19 claims
- 2784US5136948AMarking method and apparatusSHINKAWA KK·Filed 1990·Granted Aug 11, 1992·25 cites·2 claims
- 2884US4932584AMethod of wire bondingSHINKAWA KK·Filed 1989·Granted Jun 12, 1990·74 cites·3 claims
- 2983US10978420B2Semiconductor chip mounting apparatus and semiconductor chip mounting methodSHINKAWA KK·Filed 2018·Granted Apr 13, 2021·4 cites·20 claims
- 3083US9899348B2Wire bonding apparatus and method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2016·Granted Feb 20, 2018·4 cites·9 claims
- 3183US9603262B2Electronic component mounting apparatus and methodSHINKAWA KK·Filed 2015·Granted Mar 21, 2017·6 cites·2 claims
- 3283US7886956B2Bonding apparatus and bonding stage height adjustment method for the bonding apparatusSHINKAWA KK·Filed 2010·Granted Feb 15, 2011·7 cites·6 claims
- 3382US6578753B1Ultrasonic transducer for a bonding apparatus and method for manufacturing the sameSHINKAWA KK·Filed 2000·Granted Jun 17, 2003·37 cites·6 claims
- 3482US5134932ASelf adjusting printing device and methodSHINKAWA KK·Filed 1990·Granted Aug 4, 1992·32 cites·4 claims
- 3581US10492351B2Mounting apparatus and measuring methodSHINKAWA KK·Filed 2017·Granted Nov 26, 2019·3 cites·3 claims
- 3681US6464126B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2001·Granted Oct 15, 2002·32 cites·10 claims
- 3780US9385104B2Bonding apparatusSHINKAWA KK·Filed 2014·Granted Jul 5, 2016·6 cites·6 claims
- 3879US11450640B2Wire bonding apparatus and manufacturing method for semiconductor apparatusSHINKAWA KK·Filed 2018·Granted Sep 20, 2022·3 cites·10 claims
- 3979US7934634B2Wire bonding methodSHINKAWA KK·Filed 2009·Granted May 3, 2011·8 cites·4 claims
- 4079US7324684B2Bonding apparatusSHINKAWA KK·Filed 2006·Granted Jan 29, 2008·7 cites·2 claims
- 4178US11509126B2Wiring structure with movement mechanismSHINKAWA KK·Filed 2018·Granted Nov 22, 2022·3 cites·7 claims
- 4278USD927575SHeater block for bonding apparatusSHINKAWA KK·Filed 2019·Granted Aug 10, 2021·1 cites·1 claims
- 4378US9536856B2Flip chip bonder and flip chip bonding methodSHINKAWA KK·Filed 2015·Granted Jan 3, 2017·3 cites·15 claims
- 4478US6467673B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·27 cites·9 claims
- 4578US5031334AAligning method and apparatus for attaching a printing plate to a plate holderSHINKAWA KK·Filed 1990·Granted Jul 16, 1991·33 cites·2 claims
- 4677US11376627B2Ultrasonic hornSHINKAWA KK·Filed 2016·Granted Jul 5, 2022·2 cites·2 claims
- 4777US10586781B2Bonding apparatus and method of estimating position of landing point of bonding toolSHINKAWA KK·Filed 2016·Granted Mar 10, 2020·3 cites·6 claims
- 4877US9887174B2Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatusSHINKAWA KK·Filed 2016·Granted Feb 6, 2018·3 cites·4 claims
- 4977US9379086B2Method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2015·Granted Jun 28, 2016·4 cites·4 claims
- 5077US9368471B2Wire-bonding apparatus and method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2015·Granted Jun 14, 2016·3 cites·9 claims
Showing the top 50 of 537 patent records by PatentIndex Score.
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