Assignee
SHIU CHUAN-JIN
TW·3 granted patents·15 citations·filing 2012–2012
Top patents by PatentIndex Score
3 records- 0188US8890191B2Chip package and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Nov 18, 2014·13 cites·16 claims
- 0261US8785956B2Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Jul 22, 2014·2 cites·20 claims
- 0332US8900913B2Chip package and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Dec 2, 2014·0 cites·19 claims
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