Assignee
SILICON GENESIS CORP
US·133 granted patents·27 pending applications·12,484 citations·filing 1997–2024
Top patents by PatentIndex Score
160 records- 0199US7674687B2Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving processSILICON GENESIS CORP·Filed 2005·Granted Mar 9, 2010·300 cites·18 claims
- 0299US7371660B2Controlled cleaving processSILICON GENESIS CORP·Filed 2005·Granted May 13, 2008·289 cites·56 claims
- 0399US7351644B2Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer processSILICON GENESIS CORP·Filed 2006·Granted Apr 1, 2008·290 cites·25 claims
- 0499US7166520B1Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer processSILICON GENESIS CORP·Filed 2005·Granted Jan 23, 2007·385 cites·35 claims
- 0599US6790747B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2002·Granted Sep 14, 2004·239 cites·24 claims
- 0699US6632724B2Controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Oct 14, 2003·163 cites·31 claims
- 0799US6528391B1Controlled cleavage process and device for patterned filmsSILICON GENESIS CORP·Filed 1999·Granted Mar 4, 2003·422 cites·22 claims
- 0899US6146979APressurized microbubble thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 1998·Granted Nov 14, 2000·292 cites·10 claims
- 0999US6048411ASilicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 1998·Granted Apr 11, 2000·266 cites·11 claims
- 1099US6033974AMethod for controlled cleaving processSILICON GENESIS CORP·Filed 1999·Granted Mar 7, 2000·386 cites·20 claims
- 1199US6013563AControlled cleaning processSILICON GENESIS CORP·Filed 1998·Granted Jan 11, 2000·330 cites·48 claims
- 1299US6010579AReusable substrate for thin film separationSILICON GENESIS CORP·Filed 1998·Granted Jan 4, 2000·254 cites·15 claims
- 1399US5985742AControlled cleavage process and device for patterned filmsSILICON GENESIS CORP·Filed 1998·Granted Nov 16, 1999·493 cites·22 claims
- 1498US7759220B2Method and structure for fabricating solar cells using a layer transfer processSILICON GENESIS CORP·Filed 2007·Granted Jul 20, 2010·61 cites·25 claims
- 1598US6548382B1Gettering technique for wafers made using a controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Apr 15, 2003·162 cites·20 claims
- 1698US6458672B1Controlled cleavage process and resulting device using beta annealingSILICON GENESIS CORP·Filed 2000·Granted Oct 1, 2002·84 cites·56 claims
- 1798US6391740B1Generic layer transfer methodology by controlled cleavage processSILICON GENESIS CORP·Filed 1999·Granted May 21, 2002·163 cites·20 claims
- 1898US6321134B1Clustertool system software using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Nov 20, 2001·357 cites·23 claims
- 1998US6184111B1Pre-semiconductor process implant and post-process film separationSILICON GENESIS CORP·Filed 1999·Granted Feb 6, 2001·251 cites·7 claims
- 2098US6159824ASilicon-on-silicon wafer bonding process using a thin film blister-separation methodSILICON GENESIS CORP·Filed 1998·Granted Dec 12, 2000·188 cites·8 claims
- 2198US6013567AControlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1999·Granted Jan 11, 2000·154 cites·4 claims
- 2298US5994207AControlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1998·Granted Nov 30, 1999·244 cites·24 claims
- 2397US7160790B2Controlled cleaving processSILICON GENESIS CORP·Filed 2003·Granted Jan 9, 2007·70 cites·39 claims
- 2497US7056808B2Cleaving process to fabricate multilayered substrates using low implantation dosesSILICON GENESIS CORP·Filed 2002·Granted Jun 6, 2006·121 cites·16 claims
- 2597US6908832B2In situ plasma wafer bonding methodSILICON GENESIS CORP·Filed 2003·Granted Jun 21, 2005·134 cites·37 claims
- 2697US6632324B2System for the plasma treatment of large area substratesSILICON GENESIS CORP·Filed 1997·Granted Oct 14, 2003·138 cites·28 claims
- 2797US6513564B2Nozzle for cleaving substratesSILICON GENESIS CORP·Filed 2001·Granted Feb 4, 2003·116 cites·5 claims
- 2897US6511899B1Controlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1999·Granted Jan 28, 2003·133 cites·11 claims
- 2997US6486041B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2001·Granted Nov 26, 2002·124 cites·20 claims
- 3097US6448152B1Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customerSILICON GENESIS CORP·Filed 2001·Granted Sep 10, 2002·149 cites·29 claims
- 3197US6290804B1Controlled cleavage process using patterningSILICON GENESIS CORP·Filed 1998·Granted Sep 18, 2001·121 cites·67 claims
- 3297US6245161B1Economical silicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 1998·Granted Jun 12, 2001·127 cites·20 claims
- 3397US6207005B1Cluster tool apparatus using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Mar 27, 2001·209 cites·18 claims
- 3497US6187110B1Device for patterned filmsSILICON GENESIS CORP·Filed 1999·Granted Feb 13, 2001·123 cites·1 claims
- 3597US6186091B1Shielded platen design for plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Feb 13, 2001·166 cites·11 claims
- 3697US6180496B1In situ plasma wafer bonding methodSILICON GENESIS CORP·Filed 1998·Granted Jan 30, 2001·249 cites·8 claims
- 3797US6083324AGettering technique for silicon-on-insulator wafersSILICON GENESIS CORP·Filed 1998·Granted Jul 4, 2000·252 cites·26 claims
- 3896US11410984B1Three dimensional integrated circuit with lateral connection layerSILICON GENESIS CORP·Filed 2021·Granted Aug 9, 2022·9 cites·20 claims
- 3996US7811900B2Method and structure for fabricating solar cells using a thick layer transfer processSILICON GENESIS CORP·Filed 2007·Granted Oct 12, 2010·32 cites·59 claims
- 4096US6969668B1Treatment method of film quality for the manufacture of substratesSILICON GENESIS CORP·Filed 2000·Granted Nov 29, 2005·104 cites·23 claims
- 4196US6558802B1Silicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 2000·Granted May 6, 2003·59 cites·18 claims
- 4296US6534381B2Method for fabricating multi-layered substratesSILICON GENESIS CORP·Filed 2000·Granted Mar 18, 2003·139 cites·25 claims
- 4396US6335264B1Controlled cleavage thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 2000·Granted Jan 1, 2002·60 cites·17 claims
- 4496US6284631B1Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Sep 4, 2001·86 cites·17 claims
- 4596US6162705AControlled cleavage process and resulting device using beta annealingSILICON GENESIS CORP·Filed 1998·Granted Dec 19, 2000·113 cites·52 claims
- 4696US6153524ACluster tool method using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Nov 28, 2000·150 cites·73 claims
- 4795US9704835B2Three dimensional integrated circuitSILICON GENESIS CORP·Filed 2016·Granted Jul 11, 2017·32 cites·22 claims
- 4895US8012851B2Method and structure for fabricating solar cellsSILICON GENESIS CORP·Filed 2010·Granted Sep 6, 2011·15 cites·7 claims
- 4995US7911016B2Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving processSILICON GENESIS CORP·Filed 2010·Granted Mar 22, 2011·14 cites·24 claims
- 5095US7479441B2Method and apparatus for flag-less water bonding toolSILICON GENESIS CORP·Filed 2006·Granted Jan 20, 2009·43 cites·39 claims
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