Assignee
SILICONWARE PREC IND
US·2 granted patents·2 pending applications·44 citations·filing 1999–2003
Top patents by PatentIndex Score
4 records- 0165US6249433B1Heat-dissipating device for integrated circuit packageSILICONWARE PREC IND·Filed 1999·Granted Jun 19, 2001·31 cites·19 claims
- 0253US6492828B2System and method for detecting bonding status of bonding wire of semiconductor packageSILICONWARE PREC IND·Filed 2001·Granted Dec 10, 2002·13 cites·15 claims
- 0337US2005035444A1Multi-chip package device with heat sink and fabrication method thereofSILICONWARE PREC IND·Filed 2003·Application pending·0 cites
- 0425US2003029901A1System and method for detecting bonding status of bonding wire of semiconductor packageSILICONWARE PREC IND·Filed 2002·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →