Assignee
SILICONWARE PRECISION IND CO L
TW·3 granted patents·214 citations·filing 1997–1999
Top patents by PatentIndex Score
3 records- 0187US6114752ASemiconductor package having lead frame with an exposed base padSILICONWARE PRECISION IND CO L·Filed 1999·Granted Sep 5, 2000·115 cites·15 claims
- 0279US6083775AMethod of encapsulating a chipSILICONWARE PRECISION IND CO L·Filed 1999·Granted Jul 4, 2000·69 cites·8 claims
- 0363US5961912AEncapsulating method of substrate based electronic deviceSILICONWARE PRECISION IND CO L·Filed 1997·Granted Oct 5, 1999·30 cites·3 claims
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