Assignee
SILICONWARE PRECISION INDUSTRIES CO LTD
TW·752 granted patents·417 pending applications·16,096 citations·filing 1998–2025
Top patents by PatentIndex Score
1,169 records- 0199US6828665B2Module device of stacked semiconductor packages and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 7, 2004·249 cites·14 claims
- 0299US6559525B2Semiconductor package having heat sink at the outer surfaceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 6, 2003·294 cites·7 claims
- 0399US6545332B2Image sensor of a quad flat packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 8, 2003·432 cites·10 claims
- 0499US6384472B1Leadless image sensor package structure and method for making the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 7, 2002·480 cites·15 claims
- 0598US6667546B2Ball grid array semiconductor package and substrate without power ring or ground ringSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 23, 2003·218 cites·20 claims
- 0698US6590281B2Crack-preventive semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jul 8, 2003·179 cites·8 claims
- 0798US6507120B2Flip chip type quad flat non-leaded packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jan 14, 2003·241 cites·21 claims
- 0898US6414385B1Quad flat non-lead package of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jul 2, 2002·335 cites·15 claims
- 0998US6218731B1Tiny ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Apr 17, 2001·384 cites·24 claims
- 1098US6198171B1Thermally enhanced quad flat non-lead package of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Mar 6, 2001·357 cites·6 claims
- 1197US6787918B1Substrate structure of flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 7, 2004·135 cites·13 claims
- 1297US6593662B1Stacked-die package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 15, 2003·203 cites·26 claims
- 1397US6573610B1Substrate of semiconductor package for flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 3, 2003·133 cites·16 claims
- 1497US6525942B2Heat dissipation ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Feb 25, 2003·199 cites·15 claims
- 1597US6507104B2Semiconductor package with embedded heat-dissipating deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 14, 2003·147 cites·11 claims
- 1697US6476474B1Dual-die package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Nov 5, 2002·245 cites·10 claims
- 1797US6444498B1Method of making semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 3, 2002·146 cites·19 claims
- 1897US6369455B1Externally-embedded heat-dissipating device for ball grid array integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 9, 2002·149 cites·14 claims
- 1997US6282094B1Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·182 cites·23 claims
- 2096US12068211B2Electronic package comprising multiple wires inside an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Aug 20, 2024·4 cites·9 claims
- 2196US12068535B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 20, 2024·4 cites·37 claims
- 2296US12014967B2Manufacturing method of electronic package comprising a wire within an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jun 18, 2024·4 cites·10 claims
- 2396US11764188B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 19, 2023·7 cites·10 claims
- 2496US11728234B2Electronic package comprising wire inside an electronic component and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Aug 15, 2023·6 cites·9 claims
- 2596US11676948B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 13, 2023·6 cites·11 claims
- 2696US10062651B2Packaging substrate and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 28, 2018·48 cites·20 claims
- 2796US7934313B1Package structure fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted May 3, 2011·132 cites·32 claims
- 2896US7772685B2Stacked semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Aug 10, 2010·44 cites·8 claims
- 2996US7364944B2Method for fabricating thermally enhanced semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Apr 29, 2008·46 cites·10 claims
- 3096US6630729B2Low-profile semiconductor package with strengthening structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 7, 2003·116 cites·8 claims
- 3196US6603196B2Leadframe-based semiconductor package for multi-media cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 5, 2003·185 cites·10 claims
- 3296US6388313B1Multi-chip moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 14, 2002·207 cites·10 claims
- 3395US11315881B1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·14 claims
- 3495US11195808B2Electronic package having antenna function and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 7, 2021·5 cites·13 claims
- 3595US7314820B2Carrier-free semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Jan 1, 2008·74 cites·18 claims
- 3695US7173828B2Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 6, 2007·106 cites·12 claims
- 3795US7102239B2Chip carrier for semiconductor chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 5, 2006·98 cites·8 claims
- 3895US6777819B2Semiconductor package with flash-proof deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 17, 2004·106 cites·7 claims
- 3995US6483178B1Semiconductor device package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Nov 19, 2002·135 cites·20 claims
- 4095US6476469B2Quad flat non-leaded package structure for housing CMOS sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 5, 2002·277 cites·13 claims
- 4195US6359341B1Ball grid array integrated circuit package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·114 cites·20 claims
- 4295US6246111B1Universal lead frame type of quad flat non-lead package of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 12, 2001·129 cites·11 claims
- 4395US6184573B1Chip packagingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Feb 6, 2001·179 cites·11 claims
- 4494US11610850B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Mar 21, 2023·3 cites·10 claims
- 4594US11532528B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·18 claims
- 4694US10410970B1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 10, 2019·13 cites·19 claims
- 4794US7371617B2Method for fabricating semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted May 13, 2008·29 cites·13 claims
- 4894US7271483B2Bump structure of semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 18, 2007·76 cites·18 claims
- 4994US7208825B2Stacked semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 24, 2007·35 cites·4 claims
- 5094US7170152B2Wafer level semiconductor package with build-up layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 30, 2007·73 cites·11 claims
Showing the top 50 of 1,169 patent records by PatentIndex Score.
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