Assignee
SILTRONIC CORP
US·3 granted patents·4 pending applications·13 citations·filing 2002–2022
Top patents by PatentIndex Score
7 records- 0164US7416962B2Method for processing a semiconductor wafer including back side grindingSILTRONIC CORP·Filed 2002·Granted Aug 26, 2008·13 cites·23 claims
- 0250US12226873B2System and method for processing silicon wafersSILTRONIC CORP·Filed 2022·Granted Feb 18, 2025·0 cites·19 claims
- 0348US11717930B2Method for simultaneously cutting a plurality of disks from a workpieceSILTRONIC CORP·Filed 2021·Granted Aug 8, 2023·0 cites·12 claims
- 0435US2011099830A1Tool positioning systemSILTRONIC CORP·Filed 2010·Application pending·0 cites
- 0532US2011078884A1Tool for compressing and inserting a pliable member into a channelSILTRONIC CORP·Filed 2010·Application pending·0 cites
- 0630US2009215202A1Controlled edge resistivity in a silicon waferSILTRONIC CORP·Filed 2008·Application pending·0 cites
- 0730US2009214843A1Controlled edge resistivity in a silicon waferSILTRONIC CORP·Filed 2008·Application pending·0 cites
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