Assignee
SIM LIGHTING DESIGN COMPANY LTD
HK·5 granted patents·34 citations·filing 2015–2015
Top patents by PatentIndex Score
5 records- 0182US10563824B2Substrate used for LED encapsulation, three-dimensional LED encapsulation, bulb comprising three-dimensional LED encapsulation and manufacturing method thereforSIM LIGHTING DESIGN COMPANY LTD·Filed 2015·Granted Feb 18, 2020·6 cites·29 claims
- 0270USD759856SPortion of a light bulbSIM LIGHTING DESIGN COMPANY LTD·Filed 2015·Granted Jun 21, 2016·15 cites·1 claims
- 0356USD759857SPortion of a light bulbSIM LIGHTING DESIGN COMPANY LTD·Filed 2015·Granted Jun 21, 2016·8 cites·1 claims
- 0443USD761450SPortion of a light bulbSIM LIGHTING DESIGN COMPANY LTD·Filed 2015·Granted Jul 12, 2016·4 cites·1 claims
- 0531USD765276SPortion of a LED light bulbSIM LIGHTING DESIGN COMPANY LTD·Filed 2015·Granted Aug 30, 2016·1 cites·1 claims
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