Assignee
SIRINORAKUL SARAVUTH
TH·14 granted patents·2 pending applications·110 citations·filing 2008–2012
Top patents by PatentIndex Score
16 records- 0196US8063470B1Method and apparatus for no lead semiconductor packageSIRINORAKUL SARAVUTH·Filed 2008·Granted Nov 22, 2011·41 cites·16 claims
- 0294US9006034B1Post-mold for semiconductor package having exposed tracesSIRINORAKUL SARAVUTH·Filed 2012·Granted Apr 14, 2015·16 cites·12 claims
- 0393US8129229B1Method of manufacturing semiconductor package containing flip-chip arrangementSIRINORAKUL SARAVUTH·Filed 2010·Granted Mar 6, 2012·18 cites·14 claims
- 0487US8338922B1Molded leadframe substrate semiconductor packageSIRINORAKUL SARAVUTH·Filed 2010·Granted Dec 25, 2012·8 cites·9 claims
- 0579US8871571B2Apparatus for and methods of attaching heat slugs to package topsSIRINORAKUL SARAVUTH·Filed 2011·Granted Oct 28, 2014·5 cites·27 claims
- 0674US9349679B2Singulation method for semiconductor package with plating on side of connectorsSIRINORAKUL SARAVUTH·Filed 2011·Granted May 24, 2016·3 cites·19 claims
- 0774US8071426B2Method and apparatus for no lead semiconductor packageSIRINORAKUL SARAVUTH·Filed 2010·Granted Dec 6, 2011·3 cites·20 claims
- 0871US8125077B2Package with heat transferSIRINORAKUL SARAVUTH·Filed 2010·Granted Feb 28, 2012·3 cites·21 claims
- 0970US9449900B2Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflowSIRINORAKUL SARAVUTH·Filed 2010·Granted Sep 20, 2016·3 cites·13 claims
- 1069US9761435B1Flip chip cavity packageSIRINORAKUL SARAVUTH·Filed 2008·Granted Sep 12, 2017·4 cites·16 claims
- 1169US8575732B2Leadframe based multi terminal IC packageSIRINORAKUL SARAVUTH·Filed 2011·Granted Nov 5, 2013·2 cites·11 claims
- 1264US8816482B2Flip-chip leadframe semiconductor packageSIRINORAKUL SARAVUTH·Filed 2008·Granted Aug 26, 2014·3 cites·19 claims
- 1363US9397031B2Post-mold for semiconductor package having exposed tracesSIRINORAKUL SARAVUTH·Filed 2012·Granted Jul 19, 2016·1 cites·15 claims
- 1440US2012066899A1Qfn process for strip testSIRINORAKUL SARAVUTH·Filed 2011·Application pending·0 cites
- 1540US2012094438A1Apparatus for and methods of attaching heat slugs to package topsSIRINORAKUL SARAVUTH·Filed 2011·Application pending·0 cites
- 1639US9947605B2Flip chip cavity packageSIRINORAKUL SARAVUTH·Filed 2010·Granted Apr 17, 2018·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →