Assignee
SONG EUN-SEOK
KR·6 granted patents·22 citations·filing 2007–2012
Top patents by PatentIndex Score
6 records- 0184US8143713B2Chip-on-board packageSONG EUN-SEOK·Filed 2010·Granted Mar 27, 2012·9 cites·15 claims
- 0282US8502084B2Semiconductor package including power ball matrix and power ring having improved power integritySONG EUN SEOK·Filed 2010·Granted Aug 6, 2013·7 cites·26 claims
- 0372US8120024B2Semiconductor package having test pads on top and bottom substrate surfaces and method of testing sameSONG EUN-SEOK·Filed 2007·Granted Feb 21, 2012·3 cites·15 claims
- 0465US8647976B2Semiconductor package having test pads on top and bottom substrate surfaces and method of testing sameSONG EUN-SEOK·Filed 2012·Granted Feb 11, 2014·1 cites·8 claims
- 0562US8085545B2Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the sameSONG EUN-SEOK·Filed 2009·Granted Dec 27, 2011·2 cites·20 claims
- 0650US8552521B2Semiconductor package to remove power noise using ground impedanceSONG EUN-SEOK·Filed 2009·Granted Oct 8, 2013·0 cites·21 claims
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