Assignee
ST ASSEMBLY TEST SERVICES LTD
SG·50 granted patents·1,636 citations·filing 1999–2010
Top patents by PatentIndex Score
50 records- 0199US6861288B2Stacked semiconductor packages and method for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Mar 1, 2005·308 cites·8 claims
- 0296US7309913B2Stacked semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 18, 2007·94 cites·8 claims
- 0395US7005325B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·99 cites·10 claims
- 0494US6534859B1Semiconductor package having heat sink attached to pre-molded cavities and method for creating the packageST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Mar 18, 2003·118 cites·63 claims
- 0594US6420779B1Leadframe based chip scale package and method of producing the sameST ASSEMBLY TEST SERVICES LTD·Filed 1999·Granted Jul 16, 2002·263 cites·8 claims
- 0693US8035204B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2010·Granted Oct 11, 2011·13 cites·12 claims
- 0793US6775140B2Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devicesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 10, 2004·79 cites·24 claims
- 0893US6537848B2Super thin/super thermal ball grid array packageST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Mar 25, 2003·79 cites·13 claims
- 0990US7700404B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Apr 20, 2010·16 cites·16 claims
- 1088US7960816B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Jun 14, 2011·15 cites·12 claims
- 1188US7205651B2Thermally enhanced stacked die package and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Apr 17, 2007·45 cites·20 claims
- 1287US6927479B2Method of manufacturing a semiconductor package for a die larger than a die padST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 9, 2005·37 cites·8 claims
- 1387US6479903B2Flip chip thermally enhanced ball grid arrayST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Nov 12, 2002·42 cites·8 claims
- 1485US7339258B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Mar 4, 2008·11 cites·10 claims
- 1585US6858470B1Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Feb 22, 2005·36 cites·13 claims
- 1684US7129569B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Oct 31, 2006·28 cites·16 claims
- 1783US6960493B2Semiconductor device packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Nov 1, 2005·30 cites·16 claims
- 1882US7242101B2Integrated circuit die with pedestalST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jul 10, 2007·27 cites·44 claims
- 1981US7060536B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 13, 2006·26 cites·9 claims
- 2080US6737298B2Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted May 18, 2004·31 cites·18 claims
- 2179US7064420B2Integrated circuit leadframe with ground planeST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jun 20, 2006·28 cites·20 claims
- 2275US7153725B2Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 26, 2006·21 cites·20 claims
- 2375US6586925B2Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plateST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Jul 1, 2003·28 cites·54 claims
- 2470US6483177B1Leaded semiconductor packages and method of trimming and singulating such packagesST ASSEMBLY TEST SERVICES LTD·Filed 2000·Granted Nov 19, 2002·17 cites·5 claims
- 2569US7217599B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted May 15, 2007·13 cites·9 claims
- 2669US7008820B2Chip scale package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Mar 7, 2006·11 cites·11 claims
- 2768US7595551B2Semiconductor package for a large dieST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Sep 29, 2009·3 cites·10 claims
- 2868US7575956B2Fabrication method for semiconductor package heat spreadersST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 18, 2009·12 cites·20 claims
- 2966US8030783B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2009·Granted Oct 4, 2011·2 cites·14 claims
- 3065US7786593B2Integrated circuit die with pedestalST ASSEMBLY TEST SERVICES LTD·Filed 2007·Granted Aug 31, 2010·2 cites·20 claims
- 3165US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
- 3265US7413933B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2007·Granted Aug 19, 2008·2 cites·20 claims
- 3364US7381593B2Method and apparatus for stacked die packagingST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 3, 2008·17 cites·10 claims
- 3463US6979907B2Integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 27, 2005·9 cites·10 claims
- 3560US6759752B2Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jul 6, 2004·8 cites·12 claims
- 3658US7135760B2Moisture resistant integrated circuit leadframe packageST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Nov 14, 2006·8 cites·18 claims
- 3757US7091596B2Semiconductor packages and leadframe assembliesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·10 claims
- 3857US6617525B2Molded stiffener for flexible circuit moldingST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Sep 9, 2003·6 cites·6 claims
- 3956US6855573B2Integrated circuit package and manufacturing method therefor with unique interconnectorST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Feb 15, 2005·6 cites·10 claims
- 4054US7091469B2Packaging for optoelectronic devicesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·20 claims
- 4153US7863730B2Array-molded package heat spreader and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jan 4, 2011·5 cites·20 claims
- 4253US7327025B2Heat spreader for thermally enhanced semiconductor packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 5, 2008·5 cites·19 claims
- 4350US6750534B2Heat spreader hole pin 1 identifierST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Jun 15, 2004·4 cites·4 claims
- 4450US6604395B2Semi-automated probe benderST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Aug 12, 2003·6 cites·20 claims
- 4549US7626277B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Dec 1, 2009·0 cites·11 claims
- 4646US6686258B2Method of trimming and singulating leaded semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Feb 3, 2004·2 cites·3 claims
- 4745US6525553B1Ground pin concept for singulated ball grid arrayST ASSEMBLY TEST SERVICES LTD·Filed 2000·Granted Feb 25, 2003·6 cites·5 claims
- 4844US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
- 4939US7306133B2System for fabricating an integrated circuit package on a printed circuit boardST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 11, 2007·1 cites·10 claims
- 5039US6770962B2Disposable mold runner gate for substrate based electronic packagesST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Aug 3, 2004·0 cites·8 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →