Assignee
ST MICROELECTRONICS PTE LTD
SG·159 granted patents·41 pending applications·358 citations·filing 2010–2025
Top patents by PatentIndex Score
200 records- 0196US10429330B2Gas analyzer that detects gases, humidity, and temperatureST MICROELECTRONICS PTE LTD·Filed 2016·Granted Oct 1, 2019·14 cites·20 claims
- 0295US10254261B2Integrated air quality sensor that detects multiple gas speciesST MICROELECTRONICS PTE LTD·Filed 2016·Granted Apr 9, 2019·11 cites·19 claims
- 0394US11009474B2Adaptive test method and designs for low power mox sensorST MICROELECTRONICS PTE LTD·Filed 2018·Granted May 18, 2021·9 cites·20 claims
- 0494US10942157B2Gas sensor device for detecting gases with large moleculesST MICROELECTRONICS PTE LTD·Filed 2018·Granted Mar 9, 2021·8 cites·20 claims
- 0594US9698105B2Electronic device with redistribution layer and stiffeners and related methodsST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 4, 2017·10 cites·21 claims
- 0694US9529433B2Flexible smart gloveST MICROELECTRONICS PTE LTD·Filed 2014·Granted Dec 27, 2016·43 cites·20 claims
- 0794US9252030B1System-in-packages and methods for forming sameST MICROELECTRONICS PTE LTD·Filed 2014·Granted Feb 2, 2016·20 cites·18 claims
- 0893US9793427B1Air venting on proximity sensorST MICROELECTRONICS PTE LTD·Filed 2016·Granted Oct 17, 2017·11 cites·20 claims
- 0992US10147834B2Overmold proximity sensor and associated methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 4, 2018·11 cites·23 claims
- 1092US9176089B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 3, 2015·11 cites·12 claims
- 1191US10317357B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jun 11, 2019·5 cites·13 claims
- 1291US10061057B2Molded range and proximity sensor with optical resin lensST MICROELECTRONICS PTE LTD·Filed 2015·Granted Aug 28, 2018·8 cites·8 claims
- 1391US9525002B2Image sensor device with sensing surface cavity and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 20, 2016·11 cites·22 claims
- 1491US9449912B1Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of formingST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 20, 2016·11 cites·24 claims
- 1589US11721657B2Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 8, 2023·2 cites·20 claims
- 1689US9911890B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2016·Granted Mar 6, 2018·14 cites·24 claims
- 1789US9234876B2Durable miniature gas composition detector having fast response timeST MICROELECTRONICS PTE LTD·Filed 2013·Granted Jan 12, 2016·8 cites·16 claims
- 1888US11069667B2Wafer level proximity sensorST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 20, 2021·6 cites·19 claims
- 1988US9618653B2Microelectronic environmental sensing moduleST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 11, 2017·8 cites·7 claims
- 2086US12176220B2Optical sensor package and method of making an optical sensor packageST MICROELECTRONICS PTE LTD·Filed 2021·Granted Dec 24, 2024·1 cites·15 claims
- 2186US11404355B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 2286US9818937B2Durable miniature gas composition detector having fast response timeST MICROELECTRONICS PTE LTD·Filed 2015·Granted Nov 14, 2017·4 cites·20 claims
- 2386US9645238B1Proximity sensor, electronic apparatus and method for manufacturing proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted May 9, 2017·5 cites·23 claims
- 2486US9000542B2Suspended membrane deviceST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 7, 2015·5 cites·20 claims
- 2586US8860207B2Method of fabricating land grid array semiconductor packageST MICROELECTRONICS PTE LTD·Filed 2014·Granted Oct 14, 2014·7 cites·20 claims
- 2684US9689824B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2015·Granted Jun 27, 2017·3 cites·22 claims
- 2783US9466550B2Electronic device with redistribution layer and stiffeners and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Oct 11, 2016·3 cites·21 claims
- 2883US9385153B2Image sensor device with flexible interconnect layer and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Jul 5, 2016·4 cites·24 claims
- 2982US12439621B2Method of making a charge coupled field effect rectifier diodeST MICROELECTRONICS PTE LTD·Filed 2022·Granted Oct 7, 2025·1 cites·26 claims
- 3082US12356743B2Slanted glass edge for image sensor packageST MICROELECTRONICS PTE LTD·Filed 2024·Granted Jul 8, 2025·0 cites·17 claims
- 3182US10126462B2Proximity sensor, electronic apparatus and method for manufacturing proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Nov 13, 2018·2 cites·26 claims
- 3282US9455292B2Image sensing device with interconnect layer gapST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 27, 2016·4 cites·24 claims
- 3381US10347786B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 3481US10094797B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2017·Granted Oct 9, 2018·2 cites·19 claims
- 3581US9576912B1Wafer level chip scale package (WLCSP) having edge protectionST MICROELECTRONICS PTE LTD·Filed 2015·Granted Feb 21, 2017·4 cites·15 claims
- 3681US9448216B2Gas sensor device with frame passageways and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Granted Sep 20, 2016·3 cites·23 claims
- 3781US2025293190A1Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 3880US11502192B2Monolithic charge coupled field effect rectifier embedded in a charge coupled field effect transistorST MICROELECTRONICS PTE LTD·Filed 2021·Granted Nov 15, 2022·2 cites·26 claims
- 3980US10038108B2Glue bleeding prevention cap for optical sensor packagesST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 31, 2018·3 cites·23 claims
- 4080US2024282881A1Embedded wafer level optical sensor packagingST MICROELECTRONICS PTE LTD·Filed 2024·Application pending·0 cites
- 4179US12354986B2Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 4279US11226399B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2019·Granted Jan 18, 2022·2 cites·20 claims
- 4379US9810653B2Integrated SMO gas sensor moduleST MICROELECTRONICS PTE LTD·Filed 2014·Granted Nov 7, 2017·2 cites·28 claims
- 4479US8779443B2Overmold with single attachment using optical filmST MICROELECTRONICS PTE LTD·Filed 2012·Granted Jul 15, 2014·6 cites·17 claims
- 4577US9831357B2Semiconductor optical package and methodST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 28, 2017·4 cites·17 claims
- 4677US2026013159A1Charge coupled field effect rectifier diode and method of makingST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 4776US11828875B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 4876US11193821B2Ambient light sensor with light protectionST MICROELECTRONICS PTE LTD·Filed 2018·Granted Dec 7, 2021·2 cites·20 claims
- 4976US9608029B2Optical package with recess in transparent coverST MICROELECTRONICS PTE LTD·Filed 2013·Granted Mar 28, 2017·4 cites·25 claims
- 5076US9018723B2Infrared camera sensorST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 28, 2015·1 cites·10 claims
Showing the top 50 of 200 patent records by PatentIndex Score.
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