Assignee
ST MICROELECTRONICS PTE LTD
SG·159 granted patents·41 pending applications·358 citations·filing 2010–2025
Top patents by PatentIndex Score
200 records- 0196US10429330B2Gas analyzer that detects gases, humidity, and temperatureST MICROELECTRONICS PTE LTD·Filed 2016·Granted Oct 1, 2019·14 cites·20 claims
- 0295US10254261B2Integrated air quality sensor that detects multiple gas speciesST MICROELECTRONICS PTE LTD·Filed 2016·Granted Apr 9, 2019·11 cites·19 claims
- 0394US11009474B2Adaptive test method and designs for low power mox sensorST MICROELECTRONICS PTE LTD·Filed 2018·Granted May 18, 2021·9 cites·20 claims
- 0494US10942157B2Gas sensor device for detecting gases with large moleculesST MICROELECTRONICS PTE LTD·Filed 2018·Granted Mar 9, 2021·8 cites·20 claims
- 0594US9698105B2Electronic device with redistribution layer and stiffeners and related methodsST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 4, 2017·10 cites·21 claims
- 0694US9529433B2Flexible smart gloveST MICROELECTRONICS PTE LTD·Filed 2014·Granted Dec 27, 2016·43 cites·20 claims
- 0794US9252030B1System-in-packages and methods for forming sameST MICROELECTRONICS PTE LTD·Filed 2014·Granted Feb 2, 2016·20 cites·18 claims
- 0893US9793427B1Air venting on proximity sensorST MICROELECTRONICS PTE LTD·Filed 2016·Granted Oct 17, 2017·11 cites·20 claims
- 0992US10147834B2Overmold proximity sensor and associated methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 4, 2018·11 cites·23 claims
- 1092US9176089B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 3, 2015·11 cites·12 claims
- 1191US10317357B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jun 11, 2019·5 cites·13 claims
- 1291US10061057B2Molded range and proximity sensor with optical resin lensST MICROELECTRONICS PTE LTD·Filed 2015·Granted Aug 28, 2018·8 cites·8 claims
- 1391US9525002B2Image sensor device with sensing surface cavity and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 20, 2016·11 cites·22 claims
- 1491US9449912B1Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of formingST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 20, 2016·11 cites·24 claims
- 1589US11721657B2Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 8, 2023·2 cites·20 claims
- 1689US9911890B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2016·Granted Mar 6, 2018·14 cites·24 claims
- 1789US9234876B2Durable miniature gas composition detector having fast response timeST MICROELECTRONICS PTE LTD·Filed 2013·Granted Jan 12, 2016·8 cites·16 claims
- 1888US11069667B2Wafer level proximity sensorST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 20, 2021·6 cites·19 claims
- 1988US9618653B2Microelectronic environmental sensing moduleST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 11, 2017·8 cites·7 claims
- 2086US12176220B2Optical sensor package and method of making an optical sensor packageST MICROELECTRONICS PTE LTD·Filed 2021·Granted Dec 24, 2024·1 cites·15 claims
- 2186US11404355B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 2286US9818937B2Durable miniature gas composition detector having fast response timeST MICROELECTRONICS PTE LTD·Filed 2015·Granted Nov 14, 2017·4 cites·20 claims
- 2386US9645238B1Proximity sensor, electronic apparatus and method for manufacturing proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted May 9, 2017·5 cites·23 claims
- 2486US9000542B2Suspended membrane deviceST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 7, 2015·5 cites·20 claims
- 2586US8860207B2Method of fabricating land grid array semiconductor packageST MICROELECTRONICS PTE LTD·Filed 2014·Granted Oct 14, 2014·7 cites·20 claims
- 2684US9689824B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2015·Granted Jun 27, 2017·3 cites·22 claims
- 2783US9466550B2Electronic device with redistribution layer and stiffeners and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Oct 11, 2016·3 cites·21 claims
- 2883US9385153B2Image sensor device with flexible interconnect layer and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Jul 5, 2016·4 cites·24 claims
- 2982US12439621B2Method of making a charge coupled field effect rectifier diodeST MICROELECTRONICS PTE LTD·Filed 2022·Granted Oct 7, 2025·1 cites·26 claims
- 3082US12356743B2Slanted glass edge for image sensor packageST MICROELECTRONICS PTE LTD·Filed 2024·Granted Jul 8, 2025·0 cites·17 claims
- 3182US10126462B2Proximity sensor, electronic apparatus and method for manufacturing proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Nov 13, 2018·2 cites·26 claims
- 3282US9455292B2Image sensing device with interconnect layer gapST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 27, 2016·4 cites·24 claims
- 3381US10347786B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 3481US10094797B2Integrated multi-sensor moduleST MICROELECTRONICS PTE LTD·Filed 2017·Granted Oct 9, 2018·2 cites·19 claims
- 3581US9576912B1Wafer level chip scale package (WLCSP) having edge protectionST MICROELECTRONICS PTE LTD·Filed 2015·Granted Feb 21, 2017·4 cites·15 claims
- 3681US9448216B2Gas sensor device with frame passageways and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Granted Sep 20, 2016·3 cites·23 claims
- 3781US2025293190A1Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 3880US11502192B2Monolithic charge coupled field effect rectifier embedded in a charge coupled field effect transistorST MICROELECTRONICS PTE LTD·Filed 2021·Granted Nov 15, 2022·2 cites·26 claims
- 3980US10038108B2Glue bleeding prevention cap for optical sensor packagesST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 31, 2018·3 cites·23 claims
- 4080US2024282881A1Embedded wafer level optical sensor packagingST MICROELECTRONICS PTE LTD·Filed 2024·Application pending·0 cites
- 4179US12354986B2Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 4279US11226399B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2019·Granted Jan 18, 2022·2 cites·20 claims
- 4379US9810653B2Integrated SMO gas sensor moduleST MICROELECTRONICS PTE LTD·Filed 2014·Granted Nov 7, 2017·2 cites·28 claims
- 4479US8779443B2Overmold with single attachment using optical filmST MICROELECTRONICS PTE LTD·Filed 2012·Granted Jul 15, 2014·6 cites·17 claims
- 4577US9831357B2Semiconductor optical package and methodST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 28, 2017·4 cites·17 claims
- 4677US2026013159A1Charge coupled field effect rectifier diode and method of makingST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 4776US11828875B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 4876US11193821B2Ambient light sensor with light protectionST MICROELECTRONICS PTE LTD·Filed 2018·Granted Dec 7, 2021·2 cites·20 claims
- 4976US9608029B2Optical package with recess in transparent coverST MICROELECTRONICS PTE LTD·Filed 2013·Granted Mar 28, 2017·4 cites·25 claims
- 5076US9018723B2Infrared camera sensorST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 28, 2015·1 cites·10 claims
Showing the top 50 of 200 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →