Assignee
STANDING MARTIN
GB·15 granted patents·2 pending applications·63 citations·filing 2005–2013
Top patents by PatentIndex Score
17 records- 0192US9070642B2Electronic moduleSTANDING MARTIN·Filed 2011·Granted Jun 30, 2015·15 cites·24 claims
- 0286US9147644B2Semiconductor device and passive component integration in a semiconductor packageSTANDING MARTIN·Filed 2009·Granted Sep 29, 2015·9 cites·20 claims
- 0385US9281260B2Semiconductor packages and methods of forming the sameSTANDING MARTIN·Filed 2012·Granted Mar 8, 2016·7 cites·24 claims
- 0480US8319334B2Embedded laminated deviceSTANDING MARTIN·Filed 2009·Granted Nov 27, 2012·7 cites·20 claims
- 0579US8786072B2Semiconductor packageSTANDING MARTIN·Filed 2008·Granted Jul 22, 2014·5 cites·13 claims
- 0671US9048196B2Power semiconductor packageSTANDING MARTIN·Filed 2008·Granted Jun 2, 2015·4 cites·14 claims
- 0771US9041191B2Power semiconductor packageSTANDING MARTIN·Filed 2011·Granted May 26, 2015·1 cites·8 claims
- 0871US8061023B2Process of fabricating a semiconductor packageSTANDING MARTIN·Filed 2007·Granted Nov 22, 2011·2 cites·18 claims
- 0966US8686554B2Vertically mountable semiconductor device packageSTANDING MARTIN·Filed 2008·Granted Apr 1, 2014·3 cites·15 claims
- 1066US8603858B2Method for manufacturing a semiconductor packageSTANDING MARTIN·Filed 2011·Granted Dec 10, 2013·2 cites·23 claims
- 1165US9974187B2Power in leadSTANDING MARTIN·Filed 2013·Granted May 15, 2018·1 cites·24 claims
- 1262US8264073B2Multi-phase voltage regulation moduleSTANDING MARTIN·Filed 2008·Granted Sep 11, 2012·5 cites·20 claims
- 1362US8097938B2Conductive chip-scale packageSTANDING MARTIN·Filed 2009·Granted Jan 17, 2012·2 cites·15 claims
- 1456US8083832B2Paste for forming an interconnect and interconnect formed from the pasteSTANDING MARTIN·Filed 2008·Granted Dec 27, 2011·0 cites·14 claims
- 1552US8759156B2Method of producing laminated deviceSTANDING MARTIN·Filed 2012·Granted Jun 24, 2014·0 cites·4 claims
- 1642US2007215997A1Chip-scale packageSTANDING MARTIN·Filed 2006·Application pending·0 cites
- 1738US2005269677A1Preparation of front contact for surface mountingSTANDING MARTIN·Filed 2005·Application pending·0 cites
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