Assignee
STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD
CN·1 granted patent·7 pending applications·0 citations·filing 2023–2024
Top patents by PatentIndex Score
8 records- 0155US2024404930A1Package structure and related manufacturing method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025279394A1Bridge chip, fan-out package structure and corresponding packaging methodSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
- 0352US2024363515A1Semiconductor package structure and forming method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
- 0452US2024379701A1Sensor package structure and packaging methodSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
- 0551US2024363601A1Chip package structure and preparation method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
- 0651US2024006370A1Chip package with heat dissipation plate and manufacturing method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2023·Application pending·0 cites
- 0751US2024006339A1Chip package with heat dissipation plate and manufacturing method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2023·Application pending·0 cites
- 0849US12550727B2Elastic heat spreader for chip package, package structure and packaging methodSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·18 claims
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