Assignee
STILLMAN DANIEL JOSEPH
US·1 granted patent·1 pending application·8 citations·filing 2007–2010
Top patents by PatentIndex Score
2 records- 0178US8471577B2Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrateSTILLMAN DANIEL JOSEPH·Filed 2010·Granted Jun 25, 2013·8 cites·23 claims
- 0240US2009166810A1Semiconductor Device Crack-Deflecting Structure and MethodSTILLMAN DANIEL JOSEPH·Filed 2007·Application pending·0 cites
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