Assignee
STS SC & TELECOMM CO LTD
KR·11 granted patents·4 pending applications·86 citations·filing 2012–2016
Top patents by PatentIndex Score
15 records- 0193US8941225B2Integrated circuit package and method for manufacturing the sameSTS SC & TELECOMM CO LTD·Filed 2013·Granted Jan 27, 2015·18 cites·10 claims
- 0292US9466586B1Method for manufacturing wafer-level fan-out packageSTS SC & TELECOMM CO LTD·Filed 2015·Granted Oct 11, 2016·35 cites·6 claims
- 0389US9905436B2Wafer level fan-out package and method for manufacturing the sameSTS SC & TELECOMM CO LTD·Filed 2016·Granted Feb 27, 2018·10 cites·3 claims
- 0487US9449911B1Fan-out wafer level package and manufacturing method thereofSTS SC & TELECOMM CO LTD·Filed 2015·Granted Sep 20, 2016·6 cites·8 claims
- 0585US8912662B2Wafer-level package and method of manufacturing the sameSTS SC & TELECOMM CO LTD·Filed 2013·Granted Dec 16, 2014·9 cites·7 claims
- 0680US9905551B2Method of manufacturing wafer level packaging including through encapsulation viasSTS SC & TELECOMM CO LTD·Filed 2015·Granted Feb 27, 2018·4 cites·19 claims
- 0760US8742551B2Semiconductor package and method of manufacturing the sameSTS SC & TELECOMM CO LTD·Filed 2012·Granted Jun 3, 2014·4 cites·2 claims
- 0844US2015243535A1Cluster type semiconductor processing apparatus and method for manufacturing semiconductor device using the sameSTS SC & TELECOMM CO LTD·Filed 2014·Application pending·0 cites
- 0942US10050499B2Method of manufacturing voice coilSTS SC & TELECOMM CO LTD·Filed 2015·Granted Aug 14, 2018·0 cites·10 claims
- 1042US8785254B2Method of manufacturing high-capacity semiconductor packageSTS SC & TELECOMM CO LTD·Filed 2013·Granted Jul 22, 2014·0 cites·10 claims
- 1139US2013319731A1Printed circuit board of semiconductor package for decreasing noise by electromagnetic interferenceSTS SC & TELECOMM CO LTD·Filed 2013·Application pending·0 cites
- 1232US9349667B2Method of manufacturing stacked packageSTS SC & TELECOMM CO LTD·Filed 2014·Granted May 24, 2016·0 cites·9 claims
- 1332US2016365195A1Method for manufacturing voice coilSTS SC & TELECOMM CO LTD·Filed 2015·Application pending·0 cites
- 1424US8802498B2Method of manufacturing semiconductor package having no chip padSTS SC & TELECOMM CO LTD·Filed 2013·Granted Aug 12, 2014·0 cites·15 claims
- 1522US2014332940A1Quad Flat No-Lead Integrated Circuit Package and Method for Manufacturing the PackageSTS SC & TELECOMM CO LTD·Filed 2013·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →