Assignee
SU YUAN-CHANG
TW·4 granted patents·86 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0195US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0295US8320134B2Embedded component substrate and manufacturing methods thereofSU YUAN-CHANG·Filed 2010·Granted Nov 27, 2012·35 cites·20 claims
- 0392US8284561B2Embedded component package structureSU YUAN-CHANG·Filed 2010·Granted Oct 9, 2012·16 cites·19 claims
- 0485US8786062B2Semiconductor package and process for fabricating sameSU YUAN-CHANG·Filed 2010·Granted Jul 22, 2014·8 cites·6 claims
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