Assignee
SUBSTRATE TECHNOLOGIES INC
US·5 granted patents·266 citations·filing 1998–2001
Top patents by PatentIndex Score
5 records- 0193US6300165B2Ball grid substrate for lead-on-chip semiconductor packageSUBSTRATE TECHNOLOGIES INC·Filed 2001·Granted Oct 9, 2001·68 cites·19 claims
- 0288US6107683ASequentially built integrated circuit packageSUBSTRATE TECHNOLOGIES INC·Filed 1998·Granted Aug 22, 2000·106 cites·12 claims
- 0384US6534861B1Ball grid substrate for lead-on-chip semiconductor packageSUBSTRATE TECHNOLOGIES INC·Filed 1999·Granted Mar 18, 2003·58 cites·23 claims
- 0457US6501168B1Substrate for an integrated circuit packageSUBSTRATE TECHNOLOGIES INC·Filed 1999·Granted Dec 31, 2002·20 cites·19 claims
- 0546US6248612B1Method for making a substrate for an integrated circuit packageSUBSTRATE TECHNOLOGIES INC·Filed 1999·Granted Jun 19, 2001·14 cites·20 claims
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