Assignee
SUN MING
CN·22 granted patents·7 pending applications·445 citations·filing 2004–2015
Top patents by PatentIndex Score
29 records- 0197US8441756B1Method and system for providing an antiferromagnetically coupled writerSUN MING·Filed 2010·Granted May 14, 2013·150 cites·10 claims
- 0296US8670211B1Method and system for providing high magnetic flux saturation CoFe filmsSUN MING·Filed 2011·Granted Mar 11, 2014·153 cites·16 claims
- 0394USD724254SMushroom lampSUN MING·Filed 2013·Granted Mar 10, 2015·73 cites·1 claims
- 0489US8124453B2Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminatesSUN MING·Filed 2010·Granted Feb 28, 2012·10 cites·4 claims
- 0585US8159828B2Low profile flip chip power module and method of makingSUN MING·Filed 2007·Granted Apr 17, 2012·15 cites·5 claims
- 0683US8998111B2Variable flow concentration product dispenserSUN MING·Filed 2011·Granted Apr 7, 2015·7 cites·14 claims
- 0773US9337132B2Methods and configuration for manufacturing flip chip contact (FCC) power packageSUN MING·Filed 2013·Granted May 10, 2016·3 cites·7 claims
- 0873US8058646B2Programmable resistive memory cell with oxide layerSUN MING·Filed 2009·Granted Nov 15, 2011·4 cites·17 claims
- 0971US8330264B2Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layersSUN MING·Filed 2012·Granted Dec 11, 2012·2 cites·20 claims
- 1070US8168477B2Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layersSUN MING·Filed 2010·Granted May 1, 2012·2 cites·7 claims
- 1167US9387499B2Variable flow concentration product dispenserSUN MING·Filed 2015·Granted Jul 12, 2016·1 cites·12 claims
- 1267US7202113B2Wafer level bumpless method of making a flip chip mounted semiconductor device packageSUN MING·Filed 2005·Granted Apr 10, 2007·4 cites·14 claims
- 1365US8623651B2Enhancin gene bel1 from Bacillus thuringiensis and its use in biological insecticideSUN MING·Filed 2009·Granted Jan 7, 2014·1 cites·5 claims
- 1465US8426960B2Wafer level chip scale packagingSUN MING·Filed 2007·Granted Apr 23, 2013·3 cites·22 claims
- 1561US8583606B2Storing method of performance data and system thereofSUN MING·Filed 2010·Granted Nov 12, 2013·1 cites·8 claims
- 1661US8446752B2Programmable metallization cell switch and memory units containing the sameSUN MING·Filed 2009·Granted May 21, 2013·4 cites·19 claims
- 1759US8564049B2Flip chip contact (FCC) power packageSUN MING·Filed 2008·Granted Oct 22, 2013·1 cites·18 claims
- 1859US8105549B2Sample collection deviceSUN MING·Filed 2008·Granted Jan 31, 2012·1 cites·7 claims
- 1958USD679854SElectronic candle lightSUN MING·Filed 2012·Granted Apr 9, 2013·10 cites·1 claims
- 2056US8288753B2Programmable resistive memory cell with oxide layerSUN MING·Filed 2011·Granted Oct 16, 2012·0 cites·14 claims
- 2147US7466014B2Flip chip mounted semiconductor device package having a dimpled leadframeSUN MING·Filed 2007·Granted Dec 16, 2008·0 cites·5 claims
- 2246US2012015404A1Gene cluster for thuringiensin synthesisSUN MING·Filed 2009·Application pending·0 cites
- 2345US2012167384A1Method of Making a Low Profile Flip Chip Power ModuleSUN MING·Filed 2012·Application pending·0 cites
- 2439US8909666B2Data query system and constructing method thereof and corresponding data query methodSUN MING·Filed 2010·Granted Dec 9, 2014·0 cites·18 claims
- 2539US2007148875A1Common drain dual semiconductor chip scale package and method of fabricating sameSUN MING·Filed 2005·Application pending·0 cites
- 2639US2016260876A1Led light source and manufacturing method thereofSUN MING·Filed 2014·Application pending·0 cites
- 2739US2016258580A1Led light bulb and manufacturing method thereofSUN MING·Filed 2014·Application pending·0 cites
- 2838US2006145319A1Flip chip contact (FCC) power packageSUN MING·Filed 2004·Application pending·0 cites
- 2936US2016276318A1Package of LED Chip and Manufacturing Method ThereofSUN MING·Filed 2014·Application pending·0 cites
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