Assignee
SUN YANGYANG
US·1 granted patent·1 pending application·12 citations·filing 2012–2012
Top patents by PatentIndex Score
2 records- 0184US9362143B2Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packagesSUN YANGYANG·Filed 2012·Granted Jun 7, 2016·12 cites·26 claims
- 0235US2013313710A1Semiconductor Constructions and Methods of Forming Semiconductor ConstructionsSUN YANGYANG·Filed 2012·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →