Assignee
SUNG MING-CHUNG
TW·3 granted patents·9 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0182US8652939B2Method and apparatus for die assemblySUNG MING-CHUNG·Filed 2011·Granted Feb 18, 2014·6 cites·14 claims
- 0266US8796132B2System and method for forming uniform rigid interconnect structuresSUNG MING-CHUNG·Filed 2012·Granted Aug 5, 2014·2 cites·20 claims
- 0362US8664039B2Methods and apparatus for alignment in flip chip bondingSUNG MING-CHUNG·Filed 2011·Granted Mar 4, 2014·1 cites·17 claims
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