Assignee
SUNG YUH
TW·3 granted patents·13 citations·filing 2003–2008
Top patents by PatentIndex Score
3 records- 0167US8318254B2Metallization on a surface and in through-holes of a substrate and a catalyst used thereinSUNG YUH·Filed 2008·Granted Nov 27, 2012·1 cites·14 claims
- 0266US6773760B1Method for metallizing surfaces of substratesSUNG YUH·Filed 2003·Granted Aug 10, 2004·9 cites·20 claims
- 0363US8323739B2Method for forming a metal pattern on a substrateSUNG YUH·Filed 2007·Granted Dec 4, 2012·3 cites·12 claims
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