Assignee
SUPERUFO291 TEC
JP·2 granted patents·2 pending applications·0 citations·filing 2015–2022
Top patents by PatentIndex Score
4 records- 0140US12119322B2Bonding member for semiconductor deviceSUPERUFO291 TEC·Filed 2021·Granted Oct 15, 2024·0 cites·6 claims
- 0237US2024290684A1Bonding memberSUPERUFO291 TEC·Filed 2022·Application pending·0 cites
- 0333US10115655B2Heat dissipation substrate and method for producing heat dissipation substrateSUPERUFO291 TEC·Filed 2015·Granted Oct 30, 2018·0 cites·21 claims
- 0429US2017317009A1Heat dissipation substrate and method for producing heat dissipation substrateSUPERUFO291 TEC·Filed 2015·Application pending·0 cites
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