Assignee
TABEI JUN-ICHI
JP·3 granted patents·1 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0150US8648479B2Epoxy resin composition for semiconductor encapsulant and semiconductor device using the sameTABEI JUN-ICHI·Filed 2011·Granted Feb 11, 2014·1 cites·14 claims
- 0241US9070628B2Method of manufacturing esterified substanceTABEI JUN-ICHI·Filed 2011·Granted Jun 30, 2015·0 cites·5 claims
- 0336US9048187B2Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the sameTABEI JUN-ICHI·Filed 2011·Granted Jun 2, 2015·0 cites·6 claims
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