Assignee
TACHIBANA KENYA
JP·1 granted patent·2 pending applications·6 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0168US8592994B2Semiconductor package, core layer material, buildup layer material, and sealing resin compositionTACHIBANA KENYA·Filed 2007·Granted Nov 26, 2013·6 cites·11 claims
- 0237US2011180208A1Method for laminating prepreg, method for producing printed wiring board and prepreg rollTACHIBANA KENYA·Filed 2011·Application pending·0 cites
- 0335US2013058062A1Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor deviceTACHIBANA KENYA·Filed 2011·Application pending·0 cites
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