Assignee
TAIWAN IC PACKAGING CORP
TW·2 granted patents·2 pending applications·2 citations·filing 2002–2015
Top patents by PatentIndex Score
4 records- 0165US9140600B2Optical proximity sensor and manufacturing method thereofTAIWAN IC PACKAGING CORP·Filed 2013·Granted Sep 22, 2015·2 cites·12 claims
- 0240US2015357505A1Optical proximity sensor and manufacturing method thereofTAIWAN IC PACKAGING CORP·Filed 2015·Application pending·0 cites
- 0324US2004089926A1Ultra thin semiconductor deviceTAIWAN IC PACKAGING CORP·Filed 2002·Application pending·0 cites
- 0420US7238897B2Contact sensor and method for making the sameTAIWAN IC PACKAGING CORP·Filed 2005·Granted Jul 3, 2007·0 cites·20 claims
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