Assignee
TAIWAN SEMICONDUCTOR MANUFACTO
TW·7 granted patents·190 citations·filing 1994–2002
Top patents by PatentIndex Score
7 records- 0189US6440840B1Damascene process to eliminate copper defects during chemical-mechanical polishing (CMP) for making electrical interconnections on integrated circuitsTAIWAN SEMICONDUCTOR MANUFACTO·Filed 2002·Granted Aug 27, 2002·46 cites·20 claims
- 0285US6734055B1Multi-level (4 state/2-bit) stacked gate flash memory cellTAIWAN SEMICONDUCTOR MANUFACTO·Filed 2002·Granted May 11, 2004·30 cites·18 claims
- 0373US6436762B1Method for improving bit line to capacitor electrical failures on DRAM circuits using a wet etch-back to improve the bit-line-to-capacitor overlay marginsTAIWAN SEMICONDUCTOR MANUFACTO·Filed 2001·Granted Aug 20, 2002·19 cites·18 claims
- 0465US5702956ATest site and a method of monitoring via etch depths for semiconductor devicesTAIWAN SEMICONDUCTOR MANUFACTO·Filed 1996·Granted Dec 30, 1997·33 cites·20 claims
- 0561US6272902B1Method and apparatus for off-line testing a polishing headTAIWAN SEMICONDUCTOR MANUFACTO·Filed 1999·Granted Aug 14, 2001·25 cites·20 claims
- 0647US5453156AAnisotropic polysilicon plasma etch using fluorine gasesTAIWAN SEMICONDUCTOR MANUFACTO·Filed 1994·Granted Sep 26, 1995·29 cites·24 claims
- 0735US6586312B1Method for fabricating a DRAM capacitor and device madeTAIWAN SEMICONDUCTOR MANUFACTO·Filed 1998·Granted Jul 1, 2003·8 cites·12 claims
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